MediaTek has just announced the Dimensity 9400 chipset, the company’s newest flagship chipset that is aiming for the flagship processors of Qualcomm, the Snapdragon 8 Series.
The Dimensity 9400 will be made under TSMC’s 3nm process and it will come with MediaTek’s 2nd-generation All Big Core Design with 1x ARM Cortex-X925 core, 3x Cortex-X4, and 4x Cortex-A720. This design will give 35% faster single-core performance and also a 28% faster multi-core performance compared to the previous flagship, the Dimensity 9300 chipset. Despite the performance increase, the Dimensity 9400 will be 40% more power-efficient than its predecessor which means longer battery life.
While for the GPU, the Dimensity 9400 will come with a 12-core Immortalis-G925 GPU which will offer 40% better ray tracing and 41% peak performance improvement for gaming.
Other features we can expect includes support for on-device LoRA training, high quality video generation and a boost in LLM performance for AI.
As expected, it will also come with other enhancements including a 5G modem with 4CC-CA, Wi-Fi 7 support, and dual-SIM capabilities, with the first smartphones featuring the Dimensity 9400 expected by Q4 2024.
