MediaTek has unveiled the Dimensity 8300, designed specifically for premium 5G smartphones. This processor promises to deliver flagship-level experiences, generative AI capabilities, power efficiency, adaptive gaming technology, and fast connectivity.
The Dimensity 8300 is built on TSMC’s 2nd gen 4nm process and features an octa-core CPU with 4x Arm Cortex-A715 cores and 4x Cortex-A510 cores. MediaTek promises a 20% increase in CPU performance and a 30% gain in power efficiency compared to its predecessor. The chipset’s Mali-G615 MC6 GPU upgrade also offers up to 60% greater performance and 55% better power efficiency.
One of the features of the Dimensity 8300 is its full generative AI support. This is made possible by the APU 780 AI processor integrated into the chipset, which allows developers to build innovative applications that leverage large language models (LLMs) up to 10B. The APU 780 shares the same architecture as the flagship Dimensity 9300 SoC, resulting in a 2x improvement in INT and FP16 computation and a 3.3x boost in AI performance over the Dimensity 8200.
In terms of photography and video capturing, the Dimensity 8300, combined with MediaTek’s 14-bit HDR-ISP Imagiq 980, promises to elevate the smartphone photography experience. Users can expect sharper, clearer videos at 4K60 HDR, and longer recording times due to the chipset’s power-efficient design.
Other key features of the MediaTek Dimensity 8300 include LPDDR5x 8533Mbps and UFS4.0 MCQ memory, which provides a 33% speed boost on LPDDR and up to 100% faster Read/Write to flash compared to its predecessor.